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INTERNATIONAL CONGRESS ON ENGINEERING EDUCATION (ICEED 2009)

7th - 8th DEC 2009
KUALA LUMPUR, MALAYSIA

Congress Theme:
Embracing New Challenges in Engineering Education

Conference Organizer:

Faculty of Electrical Engineering, Universiti Teknologi Mara (UiTM)

Co-Organizer:

 

Centre for Engineering Education Research
Faculty of Engineering & Built Environment
National University of Malaysia

Technical Co-Sponsor:

 

IEEE Malaysia Section IEEE Education Society Malaysia Chapter	IEEE WIE Malaysia Chapter

 

 

 Date of Paper Submission is extended to be 1 September 2009

 

Faculty of Electrical Engineering, UiTM, IEEE Education Society and IEEE WIE Malaysia Chapter are pleased to announce the 1st International Congress on Engineering Education (ICEED 2009) which will be held in Kuala Lumpur, Malaysia. This international conference will serve as a forum for the sharing of innovation and good practice in engineering education. It is also hope that it will provide delegates with the opportunity to exchange knowledge, new ideas and research that might help them improve their own approach to learning, teaching and assessment.
The conference seeks papers in all aspects of engineering education  including but not limited to the following topics:

 

Prospective authors are invited to submit full paper of not more than 6 pages in standard IEEE double-column format of A4 paper size. A peer review process will be used to evaluate all papers submitted for consideration. All papers accepted to be published in the congress proceedings will be listed in the IEEE Explore.

   Accepted Registered Full paper will be included in IEEE Xplore®  digital library

IEEE Catalog Number: CFP0968H
ISBN: 978-1-4244-4844-9
Library of Congress: 2009905648